Géis de 2 componentes para um isolamento elétrico perfeito e uma proteção óptima das ligações dos cabos contra a humidade
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SI8230 Adesivo de silicone de dois componentes com condutividade térmica e retardador de chama
∎Product Description
SI8230 is two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to deep layer in room temperature.
The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standard.
∎Typical Applications
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Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
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Electronic potting glue is mainly used for fixing, sealing, potting and coating protection of electronic components, and plays the role of waterproof, moisture-proof, dust-proof, corrosion-proof and shock-proof. In recent years, with the development of the electronic and electrical industry, people pay more attention to the stability of products. In order to protect electronic products from the erosion of the natural environment and prolong their service life, stricter requirements are put forward for the weather resistance, heat dissipation, earthquake resistance and waterproofness of electronic products
Descrição
Géis de 2 componentes para um isolamento elétrico perfeito e uma proteção óptima das ligações dos cabos contra a humidade
∎Product Description
SI8230 is two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to deep layer in room temperature.
The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standard.It has different thermal conductivity can meet the different request.
We can do Thermal conductivity as follows:
Thermal conducitivity : 0.75 W/mK
Thermal conducitivity :1.0 W/mK
Thermal conducitivity : 1.5 W/mK
Thermal conducitivity : 3.0W/mK
∎Typical Applications
-
Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
-
Electronic potting glue is mainly used for fixing, sealing, potting and coating protection of electronic components, and plays the role of waterproof, moisture-proof, dust-proof, corrosion-proof and shock-proof. In recent years, with the development of the electronic and electrical industry, people pay more attention to the stability of products. In order to protect electronic products from the erosion of the natural environment and prolong their service life, stricter requirements are put forward for the weather resistance, heat dissipation, earthquake resistance and waterproofness of electronic products
∎Technical Data Table
TESTING ITEM |
ESTING STANDARD |
Part A |
Part B |
Color |
Visual inspection |
Black viscous liquid |
White viscous liquid |
Viscosity, cps , 25℃ |
GB/T 10247-2008 |
2500±500 |
2300±500 |
Density,,g/cm3, 25℃ |
GB/T 15223-1994 |
1.63±0.05 |
1.63±0.05 |
Mixture ratio |
Weight Ratio |
A:B = 100:100 |
|
Viscosity of mixture,4#rotor,cps , 25℃ |
GB/T 10247-2008 |
2500±500 |
|
Operation time,mins , 25℃ |
GB/T 10247-2008 |
50±10 |
|
Tack free, mins, 25℃ |
GB/T 10247-2008 |
90±20 |
|
Cure condition |
GB/T 10247-2008 |
25℃/3-5 hr or 80℃/ 30mins |
|
Characteristics after curing |
|||
Cured appearance |
Visual inspection |
Gray, white or black elastomer |
|
Hardness, Shore A |
GB/T 531-2008 |
55±5 |
|
Thermal conductivity,W/mK |
GB/T 10297-1998 |
1.5 | |
Linear expansion,K-1,ppm |
HGT 2625-1994 |
230 |
|
Dielectric strength ,kV/mm, 25℃ |
GB/T 1695-2005 |
≥15 |
|
Volume resistance,DC 500V, Ω·CM |
GB/T 1692-92 |
1.1×1014 |
|
Loss factor(1 MHz) |
GB/T 1693-2007 |
0.009 |
|
Dielectric constant(1 MHz) |
GB/T 1693-2007 |
3.00 |
|
Application temperature, ℃ |
GBT 20028-2005 |
– 50 ∽ 250 |
|
Flame resistance |
UL-94 |
V-0 |
∎Key Features
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Two-part1:1 mixture addition type silicone adhesive
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Low hardening shrinkage
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Excellent electrical insulationin high temperature and stability
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Good waterproof and moisture resistance
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Excellent flame resistance
∎Packing Specification
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Part A:15kg/plastic drum
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Part B:15 kg/plastic drum
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Part A:250 kg/plastic drum
Plat B:250 kg/plastic drum
∎Transport &Storage
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When stored at or below 35°C in the original unopened containers, this product has a usable life of 12 months from the date of production.
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Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
.∎Directions for Use
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Mixing uniformityin the packing before using, as there’s part of filler sedimentation happens during storage.
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Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
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Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.
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Vacuum defoaming can improve the performance of cured product.
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Seal the remaining products tightly after use.
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Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.
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It’s hard for SI8230 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.
∎Attention of operation
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Keep away from Children
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Avoid contact with eyes and skin. If contact with your skin, scrub first with soap wateror alcohol, then rinse with water. If contact with your eyes, rinse with plenty of water, andseek medical treatment immediately.
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It is forbidden to build on the surface of the wet substrate.
∎Safety Operation Data
MSDS isn’t included here. Please read TDS, MSDS and label carefully before operation. You can get MSDS from MAXTECH or other distributors, or mail to service center maxtech@shmaxtech.com
∎Warranty and Liability
All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advice we supply don’t apply in any circumstances. MAXTECH don’t make assurance of any other applications outside the specification until MAXTECH supply a special written guarantee. MAXTECH is only responsible to replace or refund if this product is defective within the warranty period stated above. MAXTECH makes it clear that will not be liable of any accidents.
∎FAQ
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Q : How long can I get a quote?
A: The quotation can be provided no longer than 24hours on condition that we know all detailed requirement.
Q: Do you accept private Label?
A: Yes. ODM & OEM are welcome
Q:Can We get a samle before order?
A: Of course. Generally, we provide 1-5 pieces free samples for quality testing and the courier fee be born by customers. Thanks for your understanding.
Q:Do you have MOQ ?
A: Yes, Generally ,MOQ is1000-2000kg
Q: How long will finished my order?A: It’s depend on your order quantity. Generally, we just need around 10 days to produce 5000kg after receive your
payment.
Q: How to find the suitable sealant ?A: Please let me know your application purpose,substrate, application method and all your requirements. We would like give you a recommendation.
Tags: Encapsulation & Potting Compounds, PCB Potting Compound For Electronics, Envasamento e encapsulamento na indústria eletrónica, Potting Material For Electronics, Silicone For Electronics, Silicone Potting & Encapsulation Materials, massa de silicone para encapsulamento, materiais de encapsulamento de silicone
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